Project Description

The aluminum substrate is a metal-based copper clad plate with good heat dissipation function. Generally, the single panel is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. Also used for high-end use is designed as a double panel, the structure is circuit layer, insulation layer, aluminum base, insulation layer, circuit layer. A very small number of applications are multi-layer boards, which can be made of ordinary multi-layer boards combined with an insulating layer and an aluminum base.

Headquarter(HongKong) Add:FLAT/RM B 5/F GAYLORD COMMERCIAL BUILDING 114-118 LOCKHART ROAD HK

Shenzhen Office Add:Houting Second Industry Park Bao’ an District,Shenzhen,China
P.C.:518100

Web:www.zpcircuit.com

Tel:+86 0755 2328 3490

Fax:+86-0755 2328 3491

Email:Info@zpcircuit.com